如何切削玻璃材料？

How to cut glass materials?

　　玻璃的成分中含有鍺、硅等半導體材料。優(yōu)于它具有比鋼鐵更高的硬度，而脆性又很大，因此屬于一種不容易加工的材料。對玻璃常見(jiàn)的切削加工種類(lèi)包括切割、研磨、拋光、鉆孔和外圓加工等工序。下面我們就來(lái)介紹一下，各個(gè)工序需要注意的事項。

The composition of glass contains semiconductor materials such as germanium and silicon. Compared to steel, it has a higher hardness and greater brittleness, making it a material that is not easy to process. The common types of cutting and processing for glass include cutting, grinding, polishing, drilling, and outer circle processing. Below we will introduce the precautions that need to be taken in each process.

　　玻璃的切割

Cutting of glass

　　切割厚度在3毫米以下的玻璃板，簡(jiǎn)單有效的方法就是：用金剛石玻璃刀或者是其他堅硬物質(zhì)在玻璃表面手工刻劃，利用刻痕處應力集中的特性，用手即可掰斷。這也是常用的手工切割玻璃的方式。

The simplest and most effective way to cut glass panels with a thickness of less than 3 millimeters is to manually scratch the glass surface with a diamond glass knife or other hard material. By taking advantage of the stress concentration at the scratch, it can be easily broken by hand. This is also the most commonly used method of manually cutting glass.

　　玻璃的機械切割一般是采用薄鐵板或不銹鋼薄片制成的圓鋸片，并且在切削過(guò)程中加入了磨料和水。常用的磨料為粒度在400號左右的碳化硅或金剛石。在切割圓形半導體晶片的時(shí)候，由于晶片厚度極小，只有0.4毫米，因此需要極高的切割精度。這時(shí)候就需要采用環(huán)形圓鋸片，利用鋸片內圓周對棒狀錠料進(jìn)行切割，切縫寬度約為0.1到0.2毫米。另外，圓形晶片也可以采用超聲波切割。而方形晶片一般是先用薄片砂輪直接劃出劃痕，然后摺斷。

The mechanical cutting of glass generally uses circular saw blades made of thin iron plates or stainless steel sheets, and abrasive and water are added during the cutting process. The commonly used abrasives are silicon carbide or diamond with a particle size of around 400. When cutting circular semiconductor chips, extremely high cutting accuracy is required due to the extremely thin thickness of the chip, which is only 0.4 millimeters. At this point, it is necessary to use a circular saw blade to cut the rod-shaped ingot material using the inner circumference of the saw blade, with a cutting seam width of about 0.1 to 0.2 millimeters. In addition, circular chips can also be cut using ultrasonic waves. Square chips, on the other hand, are usually first scratched with a thin grinding wheel and then folded.

　　玻璃的研磨和拋光

Grinding and polishing of glass

　　對于玻璃材料的研磨和拋光工作原理與金屬材料相差不大。研磨壓強通常在1000到3000帕斯卡，研磨用的磨料粒度為5到20號的石英砂、剛玉、碳化硅或碳化硼，水與磨料的比例大概為1:2。

The working principle of grinding and polishing glass materials is not much different from that of metal materials. The grinding pressure is usually between 1000 and 3000 Pascals, and the abrasive used for grinding is quartz sand, corundum, silicon carbide, or boron carbide with a particle size of 5 to 20. The ratio of water to abrasive is approximately 1:2.

　　經(jīng)過(guò)研磨的玻璃表面會(huì )形成半透明的細毛面，并存在4到5微米深的凹凸層，想要得到光澤表面必須要經(jīng)過(guò)拋光處理。拋光盤(pán)通常采用毛氈、呢絨或塑料作為材料，并使用直徑在5微米以下，粒度在5號以下的氧化鐵、氧化鈰和氧化鋯等微粉作為磨料。研磨時(shí)需要加等量的水，并制成懸浮液作為拋光劑，5到20攝氏度是理想的工作環(huán)境溫度。

The surface of the ground glass will form a semi transparent fine textured surface, with a concave convex layer of 4 to 5 microns deep. To obtain a glossy surface, polishing treatment is necessary. Polishing discs usually use felt, woolen fabric, or plastic as materials, and use micro powders such as iron oxide, ceria, and zirconia with a diameter of less than 5 microns and a particle size of less than 5 as abrasives. When grinding, an equal amount of water needs to be added and made into a suspension as a polishing agent. The ideal working environment temperature is between 5 and 20 degrees Celsius.

　　拋光需要去除的厚度約在20微米左右，約占研磨去除量的10%。但是，由于拋光工序的精密性，其所耗費的工時(shí)卻要比研磨長(cháng)得多。

The thickness that needs to be removed by polishing is about 20 microns, accounting for about 10% of the grinding removal amount. However, due to the precision of the polishing process, it requires much longer working hours than grinding.

　　切削玻璃材料的常用加工方法及其注意事項

Common processing methods and precautions for cutting glass materials

　　玻璃的鉆孔

Drilling holes in glass

　　在玻璃上鉆孔時(shí)，隨著(zhù)孔徑和形狀的差異，所采用的方法也是不同的。當孔徑在5毫米以下時(shí)，常采用的是沖擊鉆孔法。一方面用硬質(zhì)合金圓鑿以每分鐘2000轉的速度鉆削，與此同時(shí)，通過(guò)電磁振蕩器使圓鑿在玻璃表面施加6000赫茲的振動(dòng)沖擊。這種方法雙管齊下，擁有很高的加工效率，要鉆出一個(gè)2毫米孔徑、5毫米孔深5的小孔，一般只需要10秒左右就可以完成。

When drilling holes on glass, the method used varies depending on the difference in aperture and shape. When the aperture is below 5 millimeters, the commonly used method is impact drilling. On the one hand, a hard alloy chisel is used to drill at a speed of 2000 revolutions per minute, while at the same time, an electromagnetic oscillator is used to apply a vibration impact of 6000 hertz to the glass surface of the chisel. This method has a dual approach and high processing efficiency. It usually takes only about 10 seconds to drill a small hole with a diameter of 2mm and a depth of 5mm.

　　如果要鉆削的是孔徑在5毫米以上的中控或大孔時(shí)，通常采用端部開(kāi)槽的銅管或鋼管作為鉆頭，以每分鐘30米的切削速度進(jìn)行鉆削，與此同時(shí)，還要在工作部位注入碳化硅或金剛石磨料以及潤滑油。鉆削時(shí)，玻璃要放置在毛氈或橡膠墊上，并保證墊平，以防壓碎。而對于對方孔和異形孔，通常采用頻率在18000到24000赫茲的超聲波加工。

When drilling central control or large holes with a diameter of 5 millimeters or more, copper or steel pipes with slotted ends are usually used as drill bits, with a cutting speed of 30 meters per minute. At the same time, silicon carbide or diamond abrasive and lubricating oil should be injected into the working area. When drilling, the glass should be placed on a felt or rubber pad and kept flat to prevent crushing. For square and irregular holes, ultrasonic machining with frequencies ranging from 18000 to 24000 Hz is usually used.

　　玻璃的外圓加工

Outer circle processing of glass

　　玻璃的外圓加工通常采用磨削方式，砂輪材料為碳化硅?；蛘哌€可采用車(chē)削方式加工，車(chē)削轉速在每分鐘2000轉左右，車(chē)刀材料為金剛石或硬質(zhì)合金。采用硬質(zhì)合金車(chē)刀時(shí)，前角角度應該為負數。

The outer circle of glass is usually processed by grinding, and the grinding wheel material is silicon carbide. Alternatively, turning can be used, with a turning speed of around 2000 revolutions per minute, and the cutting tool material being diamond or hard alloy. When using hard alloy turning tools, the front angle should be negative.

以上就是有關(guān)  中空玻璃生產(chǎn)線(xiàn) 的介紹，想了解更多的內容請點(diǎn)擊：http://whooo.net  我們將會(huì )全心全意為您提供滿(mǎn)分服務(wù)，歡迎您的來(lái)電！

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